Research
#Power Devices #Power Electronics #(Ultra-)Wide Bandgap #TCAD Design #SiC MOSFET #GaN HEMT #Ga2O3 Device #Reliability #Robustness #Extreme Environment
#Power Devices #Power Electronics #(Ultra-)Wide Bandgap #TCAD Design #SiC MOSFET #GaN HEMT #Ga2O3 Device #Reliability #Robustness #Extreme Environment
"(Ultra-)Wide Bandgap Semiconductor for Next-Generation Power Electronics"
Kanghee Shin aims to improve the efficiency of power electronic systems by leveraging wide bandgap (WBG) power devices, with the ultimate goal of achieving carbon neutrality and addressing global energy inequality.
WBG semiconductors (SiC, GaN, Ga2O3, Diamond, AlN) permit power devices to operate at much higher temperatures, voltages, and frequencies—making the power electronic modules using these materials significantly more powerful and energy efficient than those made from conventional semiconductor materials.
WBG semiconductors go beyond the limitations of Si counterparts for power electronics applications.
High thermal stability and miniaturization of form factor are possible, as are High maximum junction temperature (TJ,max) and operating frequencies
Low on-resistance (RON,SP)
: Low conduction losses
Low parasitic capacitance (Ciss, Coss, and Crss) and gate charge (QG)
: Low switching losses in hard-switching applications
Near-zero reverse recovery charge (Qrr) and reverse recovery time (trr)
: Low switching losses in soft-switching applications
High breakdown voltage (VBR)
H. Zhang et al., IEEE Trans. Electron Devices, 2026.
W. Saito, Appl. Phys. Express, 2025. & J. P. Kozak et al., IEEE Trans. Power Electron., 2023.